COPENHAGEN, Denmark – September 29, 2025 – Under the theme “Leap into the Future of Photonics”, Accelink Technologies, a leading global provider of optoelectronic devices, is showcasing its full portfolio of next-generation optical interconnect solutions at the 2025 European Conference on Optical Communication (ECOC).

At the heart of Accelink’s exhibition is its industry-leading 1.6T OSFP224 2xDR4/2xFR4 optical transceivers, powered by a 3nm DSP and silicon photonics engine. With 30% lower power consumption compared to the previous generation, and advanced signal integrity design enabling Back-to-Back error-free transmission and a TDECQ of <2dB, the solution provides solid reliability for AI-driven computing workloads. Accelink is also debuting its 1.6T LRO and LPO series, which further optimize power and cost through simplified architectures tailored to AI interconnect requirements.

For mainstream AI deployments, Accelink introduces its next-generation 800G OSFP112 DR4/FR4 and 800G OSFP224 DR4/FR4 modules. Featuring 200G/lane silicon photonics technology, they offer flexible, scalable options for data centers accelerating AI infrastructure.

Accelink Technologies is a global leader in optoelectronic devices, delivering high-speed optical interconnect innovations for AI data centers, telecom networks, and enterprises. With strengths in photonic integration, high-speed packaging, and vertically integrated manufacturing, Accelink is driving the evolution of optical communication technology and enabling the future of global digital infrastructure.